SHINEMORE TECHNOLOGY MATERIALS CO., LTD.

ShineMore Technology Materials Co., Ltd.

8291

TW0008291006

Semiconductors

End-of-day quote Taipei Exchange Other stock markets 18:00:00 2024-06-27 EDT			5-day change	1st Jan Change
10.8 ^TWD	+2.86%		-6.49%	+72.80%

06-19	Shinemore Technology Materials Co., Ltd. Announces the Members of the 2nd Audit Committee	CI
06-19	Shinemore Technology Materials Co., Ltd. Approves the Election of Directors	CI

Shinemore Technology Materials Co., Ltd. Announces the Members of the 2nd Audit Committee

June 19, 2024 at 06:01 am

ShineMore Technology Materials Co., Ltd. announced the formation of its 2nd Audit Committee on June 19, 2024, comprising re-elected members Miyashita Teruaki and Yeh Hsin-Yuan, alongside newly appointed members Kato Shinichi and Sasaki AI.

Latest news about ShineMore Technology Materials Co., Ltd.

Shinemore Technology Materials Co., Ltd. Announces the Members of the 2nd Audit Committee	06-19	CI
Shinemore Technology Materials Co., Ltd. Approves the Election of Directors	06-19	CI
Shinemore Technology Announces Expiration of 5Th Compensation Committee Term	06-19	CI
ShineMore Technology Materials Co., Ltd. announced that it has received TWD 39.384 million in funding from Daito Me Holdings Co., Ltd and another invetsor	05-30	CI
ShineMore Technology Materials Co., Ltd. announced that it expects to receive TWD 112 million in funding from Daito Me Holdings Co., Ltd and another investor	05-15	CI
ShineMore Technology Materials Co., Ltd. announced that it has received TWD 12 million in funding from Daito Me Co Ltd	05-15	CI
ShineMore Technology Materials Co., Ltd. Reports Earnings Results for the First Quarter Ended March 31, 2024	05-15	CI
ShineMore Technology Materials Co., Ltd. announced that it expects to receive TWD 12 million in funding from Daito Me Co Ltd	05-09	CI
ShineMore Technology Materials Co., Ltd. announced that it has received TWD 39.384 million in funding from Daito Me Co Ltd and another investor	05-07	CI
ShineMore Technology Materials Co., Ltd. Reports Earnings Results for the Full Year Ended December 31, 2023	03-28	CI
ShineMore Technology Materials Co., Ltd. announced that it expects to receive TWD 39.384 million in funding from Daito Me Co Ltd and another investor	01-15	CI
ShineMore Technology Materials Co., Ltd. Reports Earnings Results for the Third Quarter and Nine Months Ended September 30, 2023	11-12	CI
ShineMore Technology Materials Co., Ltd. announced that it expects to receive funding from Daito Me Holdings Co., Ltd	11-07	CI
ShineMore Technology Materials Co., Ltd. Reports Earnings Results for the Second Quarter and Six Months Ended June 30, 2023	23-08-11	CI
ShineMore Technology Materials Co., Ltd. Reports Earnings Results for the First Quarter Ended March 31, 2023	23-05-12	CI
ShineMore Technology Materials Co., Ltd. Reports Earnings Results for the Full Year Ended December 31, 2022	23-03-30	CI
ShineMore Technology Materials Co., Ltd. Reports Earnings Results for the Third Quarter and Nine Months Ended September 30, 2022	22-11-10	CI
ShineMore Technology Materials Co., Ltd. Reports Earnings Results for the Second Quarter and Six Months Ended June 30, 2022	22-08-11	CI
ShineMore Technology Materials Co., Ltd. Reports Earnings Results for the First Quarter Ended March 31, 2022	22-05-12	CI
ShineMore Technology Materials Co., Ltd. Reports Earnings Results for the Full Year Ended December 31, 2021	22-03-28	CI
Shinemore Technology Materials Co., Ltd. Announces Board Changes, Effective December 23, 2021	21-12-22	CI
ShineMore Technology Materials Co., Ltd. Reports Earnings Results for the Third Quarter and Nine Months Ended September 30, 2021	21-11-11	CI
Shinemore Technology Materials Co., Ltd. Announces Audit Committee Appointments	21-08-27	CI
Shinemore Technology Materials Co., Ltd. Reports Earnings Results for the Second Quarter Ended June 30, 2021	21-08-11	CI
Shinemore Technology Materials Co., Ltd. Announces Resignation of Tsai, Mei-Li	21-08-03	CI

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Company Profile

ShineMore Technology Materials Co., Ltd. is a Taiwan-based company principally engaged in the manufacture, processing and sales of copper clad circuit laminations. The Company's main products include copper clad laminations (CCLs), adhesive film, parts and components and others. The Company's products are mainly used in consumer electronics, home appliances, automobiles, high speed computing, high-frequency communications and cloud computing. The Company distributes its products in domestic market and to overseas markets.

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Semiconductors

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Sector Integrated Circuits

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