Inactive Instrument

Shenzhen Danbond Technology Co.,Ltd.

002618

CNE1000016X8

Certain shares of Shenzhen Danbond Technology Co., Ltd.'s A Shares are subject to a Lock-Up Agreement Ending on 20-SEP-2014.

September 19, 2014

Certain shares of Shenzhen Danbond Technology Co., Ltd.'s A Shares are subject to a Lock-Up Agreement Ending on 20-SEP-2014. These shares will be under lockup for 1097 days starting from 19-SEP-2011 to 20-SEP-2014.

Latest news about Shenzhen Danbond Technology Co.,Ltd.

Shenzhen Danbond Technology Co.,Ltd. Reports Earnings Results for the Half Year Ended June 30, 2022	22-09-29	CI
Danbond Technology Booted From Shenzhen Bourse	22-06-22	MT
Shenzhen Danbond Technology Co.,Ltd. Announces Board Changes	22-06-07	CI
Shenzhen Danbond Technology Co.,Ltd.(SZSE:002618) dropped from Shenzhen Stock Exchange A Share Index	22-05-31	CI
Shenzhen Danbond Technology Co.,Ltd.(SZSE:002618) dropped from Shenzhen Stock Exchange Composite Index	22-05-30	CI
Danbond Technology’s Shares to Enter Delisting Transitional Period	22-05-25	MT
Shenzhen Danbond Technology Co.,Ltd. Reports Earnings Results for the First Quarter Ended March 31, 2022	22-04-29	CI
Shenzhen Danbond Technology Co.,Ltd. Reports Earnings Results for the Nine Months Ended September 30, 2021	21-10-27	CI
Shenzhen Danbond Technology Co.,Ltd. Reports Earnings Results for the Half Year Ended June 30, 2021	21-08-25	CI
Shenzhen Danbond Technology Co.,Ltd. Reports Earnings Results for the First Quarter Ended March 31, 2021	21-04-28	CI
Shenzhen Danbond Technology Co.,Ltd.(XSEC:002618) dropped from S&P Global BMI Index	20-12-21	CI
Shenzhen Danbond Technology Co.,Ltd. Reports Earnings Results for the Nine Months Ended September 30, 2020	20-10-16	CI
Shenzhen Danbond Technology Co.,Ltd. Announces Final Cash Dividend on A Shares for the Year 2019, Payable on 09 October 2020	20-09-24	CI
Shenzhen Danbond Technology Co.,Ltd. Reports Earnings Results for the Half Year Ended June 30, 2020	20-08-26	CI
Shenzhen Danbond Technology Co.,Ltd. Announces Cash Dividend	20-08-17	CI
Shenzhen Danbond Technology Co.,Ltd. Announces Final Cash Dividend for the Year 2019	20-06-30	CI
Shenzhen Danbond Technology Co.,Ltd. Reports Earnings Results for the First Quarter Ended March 31, 2020	20-04-29	CI
Shenzhen Danbond Technology Co.,Ltd. Reports Earnings Results for the Full Year Ended December 31, 2019	20-04-27	CI
Shenzhen Danbond Technology Co.,Ltd. announced that it expects to receive CNY 1.78 billion in funding	20-04-02	CI
Shenzhen Danbond Technology Co.,Ltd. cancelled the transaction announced on June 13, 2019	20-04-02	CI
Shenzhen Danbond Technology Co.,Ltd. Reports Earnings Results for the Nine Months Ended September 30, 2019	19-10-22	CI
Shenzhen Danbond Technology Co.,Ltd. Reports Earnings Results for the Half Year Ended June 30, 2019	19-08-27	CI
Shenzhen Danbond Technology Co.,Ltd.(SZSE:002618) added to Shenzhen Stock Exchange Component Index	19-07-12	CI
Shenzhen Danbond Technology Co.,Ltd. Announces Final Cash Dividend on A Shares for the Year 2018, Payable on 12 July 2019	19-07-05	CI
Shenzhen Danbond Technology Co.,Ltd. announced that it expects to receive CNY 2.15 billion in funding	19-06-12	CI

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Company Profile

Shenzhen Danbond Technology Co., Ltd. is a China-based company, principally engaged in the research and development, manufacture and distribution of electronic components. The Company's products mainly include flexible printed circuit boards (FPCs), chip on film (COF) flexible packaging substrates, as well as COF products. The Company's products are mainly applied in electronic terminals. The Company distributes its products within domestic market and to overseas markets, with Japan as its major market.

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