Melexis : demonstrates inspired automotive engineering at CAR ELE 2017
January 09, 2017 at 08:18 am
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Tessenderlo, Belgium, 8thJanuary 2017 - Global microelectronics company Melexis will once again be exhibiting at CAR ELE (Tokyo, 18th-20thJanuary, Booth E39-40). Now being staged for the 9thtime, this event is recognized globally as key tocontinued technological innovation in the automotive industry. This year's attendees will have the opportunity to access to the latest innovations from Melexis - in relation to in-vehicle networking, 3D imaging and temperature sensing - through a series of interactive demos.
The LIN RGB demo illustrates the major advances Melexis is making in the personalization of vehicles' interior lighting, based on the brand newMLX81115dual-channel driver IC. With built-in 16-bit microcontroller and 32kBytes of Flash memory, this IC enables the control of multiple LEDs through the LIN bus, with color mixing and color calibration functions being taken care of. It can also compensate for temperature changes and alteration to LED output characteristics over their lifetime.
The optical Time of-Flight (ToF) 3D imaging demo showcases Melexis' next generation of ToF semiconductor technology. This provides a streamlined ToF sensing solution that is unique in being fully optimized for automotive implementation, thanks to its sunlight robustness and its ability to operate at elevated temperature levels. Visitors to the Melexis' stand will be able to witness the capturing of detailed QVGA resolution ToF imaging data in real time for use by a vehicle's ADAS.
Highly suited to occupancy detection, as well as in-cabin monitoring for climate control, the recently releasedMLX90640is a 32 x 24 pixel resolution infrared (IR) sensor array that can deliver industry-leading noise performance, high temperature accuracy and rapid responsiveness. The demo into which this is incorporated affirms its operational effectiveness in an automotive context, providing a more compact and financially attractive alternative to high-end thermal cameras, via use of signal-enhanced thermopile technology.
All three of these very engaging demos highlight Melexis' abilities to deliver cutting-edge automotive engineering. They each draw on the company's 27 years focused on serving this market with semiconductor solutions that improve cars' energy efficiency, comfort and safety.
Melexis NV published this content on 09 January 2017 and is solely responsible for the information contained herein. Distributed by Public, unedited and unaltered, on 09 January 2017 13:18:13 UTC.
Original documenthttps://www.melexis.com/en/news/2017/09jan2017-melexis-at-car-ele-2017
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Melexis N.V. specializes in the design and marketing of semi-conductors intended primarily for automotive equipment manufacturers. The group's activity is primarily organized around 4 families of products:
- sensors: primarily circuits for interfaces, pressure and acceleration measurement, and magnetic sensors;
- actuator: micro-controllers and peripheral integrated circuits used for dashboard indicators, windshield wipers, automatic door openers, etc.;
- radiofrequency circuits: transmitters, receivers, automatic identification systems, etc.;
- multiplexing circuits: optical and infrared circuits.
At the end of 2023, the group had 5 manufacturing sites located in Belgium, Germany, France, Bulgaria and Malaysia.
Net sales are distributed geographically as follows: Germany (12.6%), Switzerland (2.7%), Romania (2.6%), France (2.2%), Italy (1.8%), Austria (1.6%), Hungary (1.1%), the United Kingdom (0.3%), Spain (0.3%), Europe/Middle East/Africa (6%), China (15.5%), Hong Kong (9.5%), Japan (8.2%), Thailand (7.7%), South Korea (7%), Asia (10%), the United States (5.8%), Mexico (2.9%) and Americas (2.2%).