The Board re-appoints members of the Company's
5th term of Compensation Committee
Date of events
2022/06/10
To which item it meets
paragraph 6
Statement
1.Date of occurrence of the change:2022/06/10
2.Name of the functional committees:
Compensation Committee
3.Name of the previous position holder:
Feng-Hsien Shih
Wan-Ping Chen
Pin-Chi Wei
4.Resume of the previous position holder:
Feng-Hsien Shih Independent Director, Member of the Audit Committee and
Member of the Compensation Committee of the company
Wan-Ping Chen Independent Director, Member of the Audit Committee and
Member of the Compensation Committee of the company
Pin-Chi Wei Independent Director, Member of the Audit Committee and
Member of the Compensation Committee of the company
5.Name of the new position holder:
Feng-Hsien Shih
Wan-Ping Chen
Pin-Chi Wei
6.Resume of the new position holder:
Feng-Hsien Shih Independent Director, Member of the Audit Committee and
Member of the Compensation Committee of the company
Wan-Ping Chen Independent Director, Member of the Audit Committee and
Member of the Compensation Committee of the company
Pin-Chi Wei Independent Director, Member of the Audit Committee and
Member of the Compensation Committee of the company
7.Circumstances of change (Please enter "resignation", "dismissal",
"term expired", "death" or "new appointment"):
Term expired
8.Reason for the change:
Re-appointment due to terms expired.
9.Original term (from __________ to __________):
2019/06/24~2022/06/11
10.Effective date of the new member:
2022/06/10
11.Any other matters that need to be specified:
None.
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Disclaimer
Lingsen Precision Industries Ltd. published this content on 10 June 2022 and is solely responsible for the information contained therein. Distributed by Public, unedited and unaltered, on 10 June 2022 08:31:03 UTC.
LINGSEN PRECISION INDUSTRIES, LTD. is a Taiwan-based company principally engaged in the packaging, processing, testing and distribution of integrated circuits (ICs) and semiconductor components. The Company mainly operates its businesses through packaging and testing of ICs and semiconductor products, including small outline package (SOP), shrink small outline package (SSOP), thin small outline package (TSOP), thin shrink small outline package (TSSOP), plastic leadless chip carrier (PLCC), quad flat package (QFP), thin quad flat package (TQFP) services, as well as photo detect ICs (PD-ICs) and others. Its products are applied in the consumer electronics, automobile electronic products, memory products, communication equipment and power management products. The Company conducts its businesses primarily in Taiwan, the Americas, the rest of Asia and Europe.
LINGSEN PRECISION INDUSTRIES, LTD. 