Japan Pure Chemical : ┗ Financial Report for the 3rd Quarter Ended December 31, 2022 （405KB） NEW

2017年３月期

Financial Report for Fiscal Year決算Ended説明March資料31, 2023

JAPAN PURE CHEMICAL CO.,LTD.

Securities Code: 4973

証券コード：4973

January 27, 2022

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Glossary(1) （Plating Method）

Term	Applications	Explanation
Electrolytic	-	Plating method on metal surfaces with
plating	electric current
Pure gold	Printed circuit boards	High-purity gold plating
plating	Semiconductor substrates
Hard gold	Connectors	Gold plating that is hardened with alloy
plating	Printed circuit boards	components
Palladium(Pd)	Lead frames	Used as undercoat for gold plating.
plating	Connectors	PPF stands for Pre Plated Lead frame.
Electroless	-	Plating method by chemical reaction without
plating	electric current
Immersion		Plating method for forming by replacing
Printed circuit boards	metal on surface by utilizing Solubility
plating
	(Ionization tendency) of each metal
Auto catalytic		Plating method capable of forming thick
Printed circuit boards	coatings by utilizing chemical reaction with
plating		reducing agent

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Glossary(2) （Plating Process）

Term	Explanation	Layer composition
ENIG	Stands for Electroless Nickel Immersion Gold.
Layer Composition is Cu-Ni-Au.
	Stands for Electroless Nickel Electroless Palladium
ENEPIG	Immersion Gold.
	Layer Composition is Cu-Ni-Pd-Au.
	Stands for Direct Immersion Gold. Since Ni plating is
DIG	omitted, it can be used for fine pitch compared to
	ENIG. Layer Composition is Cu-Au.
EPIG	Stands for Electroless Palladium Immersion Gold.
Layer Composition is Cu-Pd-Au.

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Product Lineup ～ Lineup Expansion and New Field Development ～

Plating Methods	Applications	Product Lineup

plating	Pure gold	1. Pure gold plating enabling uniform coating even on rough surfaces
	2. Pure gold plating with higher hardness
Electrolytic	Hard gold	Gold saving hard gold plating for micro connectors: OROBRIGHT BAR7
（Alloy）
	Palladium	Palladium plating for thin coating applicable to PPF: PALLABRIGHT NANO2
	(Pd)
plating		Immersion gold plating compatible with mid- to high-P Ni: IM-GOLD IB2X
Immersion gold	Immersion gold plating with less Ni corrosion: IM-GOLD CN
		Immersion gold plating without Ni plating: IM-GOLD PC
Electroless	Auto catalytic	Auto catalytic gold plating for thin coating using gold sulfite: HY-GOLD
palladium	Direct auto catalytic palladium plating: NEO PALLABRIGHT DP
	gold	Auto catalytic gold plating for thin coating using gold cyanide: HY-GOLD CN
	Auto catalytic	Auto catalytic palladium plating for ENEPIG: NEO PALLABRIGHT 2
	New fields	Base metals (copper, tin, nickel)
	Alloy plating	Post-treatment agents

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Financial Review for 3Q of FY2022 (1)

Electronic Components Industry

• Continued uncertainty in the economic environment, including the protracted situation in Ukraine and persistently high inflation, has led to a refrain from investment for cloud/data centers and for IoT devices on digital transformation in industrial machinery, factories, healthcare, and other areas.
• Production of electronic components for smartphones and PCs continues to decline due to inventory adjustments.
• In automotive electronic components, production adjustment of automobiles continued and did not lead to a recovery trend.

JPC's Financial Review

 Plating chemicals for printed circuit boards and semiconductor substrates

It has continued since the second quarter that low level of sales in plating chemicals for PCBs and semiconductor substrates, affected by sluggish demand from Chinese and Korean manufacturers for smartphones and production cutbacks in PCs and memory applications.

 Plating chemicals for connectors

Sales of plating chemicals for connectors remained sluggish, as strong demand for industrial machinery and communication infrastructure could not make up for the impact of reduced production of smartphones by Chinese and South Korean manufacturers.

 Plating chemicals for lead frames

Although they have got affected by continues production cutbacks by Chinese and Korean makers for smartphones and PCs since the second quarter, the decrease of sales in plating chemicals for lead frames was limited to a slight decline, supported by firm demand for some automotive and consumer electronics applications.

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