Japan Pure Chemical : ┗ Financial Report for the 3rd Quarter Ended Dec 31, 2021 （331KB） NEW

2017年３月期

Financial Report for Fiscal Year決算Ended説明March資料31, 2022

JAPAN PURE CHEMICAL CO.,LTD.

Securities Code: 4973

証券コード：4973

January 28, 2022

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Glossary(1) （Plating Method）

Term	Applications	Explanation
Electrolytic	-	Plating method on metal surfaces with
plating	electric current
Pure gold	Printed circuit boards	High-purity gold plating
plating	Semiconductor substrates
Hard gold	Connectors	Gold plating that is hardened with alloy
plating	Printed circuit boards	components
Palladium(Pd)	Lead frames	Used as an undercoat for gold plating.
plating	Connectors	PPF stands for Pre Plated Lead frame.
Electroless	-	Plating method by chemical reaction without
plating	electric current
Immersion		Plating method for forming by replacing
Printed circuit boards	metal on surface by utilizing Solubility
plating
	(Ionization tendency) of each metal
Auto catalytic		Plating method capable of forming thick
Printed circuit boards	coatings by utilizing chemical reaction with
plating		reducing agent

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Glossary(2) （Plating Process）

Term	Explanation	Composition of
plating
ENIG	Stands for Electroless Nickel Immersion Gold.
Composition of plating is Cu-Ni-Au.
	Stands for Electroless Nickel Electroless Palladium
ENEPIG	Immersion Gold.
	Composition of plating is Cu-Ni-Pd-Au.
	Stands for Direct Immersion Gold. Since Ni plating is
DIG	omitted, it can be used for fine pitch compared to
	ENIG. Composition of plating is Cu-Au.
EPIG	Stands for Electroless Palladium Immersion Gold.
Composition of plating is Cu-Pd-Au.

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Product Lineup ～ Lineup Expansion and New Field Development ～

Plating Methods	Applications	Product Lineup

plating	Pure gold	1. Pure gold plating enabling uniform coating even on rough surfaces
	2. Pure gold plating with higher hardness
Electrolytic	Hard gold	Gold saving hard gold plating for micro connectors: OROBRIGHT BAR7
（Alloy）
	Palladium	Palladium plating for thin coating applicable to PPF: PALLABRIGHT NANO2
	(Pd)
plating		Immersion gold plating compatible with mid- to high-P Ni: IM-GOLD IB2X
Immersion gold	Immersion gold plating with less Ni corrosion: IM-GOLD CN
		Immersion gold plating without Ni plating: IM-GOLD PC
Electroless	Auto catalytic	Auto catalytic gold plating for thin coating using gold sulfite: HY-GOLD
palladium	Direct auto catalytic palladium plating: NEO PALLABRIGHT DP
	gold	Auto catalytic gold plating for thin coating using gold cyanide: HY-GOLD CN
	Auto catalytic	Auto catalytic palladium plating for ENEPIG: NEO PALLABRIGHT 2
	New fields	Base metals (copper, tin, nickel)
	Alloy plating	Post-treatment agent

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Financial Review for 3Q of FY2021 (1)

Electronic Components Industry

• Sales in the electronic components industry were strong overall, supported by 5G-compatible smartphones and related infrastructure, data center-related demand from the spread of remote work and online learning, and IoT device demand for the digital transformation of factories and medical facilities, despite the impact of supply shortages for some semiconductors and electronic components.
• For automotive electronic components, while demand for automobiles was strong, delays in the supply of components from Southeast Asia due to the spread of COVID-19 as well as unresolved semiconductor supply shortages impacted automobile production.

JPC's Financial Review

• Sales of plating chemicals for printed circuit boards and semiconductor substrates were strong due to demand for use in 5G-compatible smartphones and data centers.
• Sales of plating chemicals for connectors were strong as they were underpinned by increased demand for use in 5G-compatible smartphones, despite a slowdown in demand for automobiles.
• Sales of plating chemicals for lead frames were favorable due to consistently high prices for noble metal palladium.

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