Integrated Service Technology Inc. announced (January 6, 2021) that it has made a breakthrough in 1.5 mil (38um) taiko wafer with high wafer strength. Meanwhile, to be more focused on serving international customers, iST has established Prosperity Power Technology Inc. (abbreviated as Propowertek), with immediate effect. iST pointed, wafer thinning has been the most direct and effective process improvement in cutting power consumption and input impedance of power semiconductors which not only reduce packaging dimension but also extends the operating life of wafers by lowering RDS (on) and heat accumulation. However, the MOSFET foundries are facing a challenge of balancing thinness and strength of wafers to minimize the risks of soaring rate of broken wafers. iST is not only to exclusively develop the thinning technology for wafers 2mil(50um), 1.5mil(38um), and even 0.4mil(10um) thick, but also strengthen wafers by reducing stress accumulation at the damage layer with its optimized process. iST can provide customized solutions to enhance wafer for Power MOSFET/IGBT and other components.