End-of-day quote
Korea S.E.
18:00:00 2024-06-26 EDT
5-day change
1st Jan Change
39,150
KRW
-3.09%
-4.86%
-10.72%
HPSP Co., Ltd.'s Equity Buyback announced on May 9, 2023, has expired with 250,000 shares, representing 0.31% for KRW 8,818.23 million.
The company expired its plan on May 8, 2024.
HPSP Co., Ltd. announces an Equity Buyback for KRW 40,000 million worth of its shares.
05-14
CI
HPSP Co., Ltd. authorizes a Buyback Plan.
05-13
CI
Tranche Update on HPSP Co., Ltd.'s Equity Buyback Plan announced on May 9, 2023.
05-08
CI
Tranche Update on HPSP Co., Ltd.'s Equity Buyback Plan announced on May 9, 2023.
05-08
CI
Tranche Update on HPSP Co., Ltd.'s Equity Buyback Plan announced on May 9, 2023.
05-08
CI
Tranche Update on HPSP Co., Ltd.'s Equity Buyback Plan announced on May 9, 2023.
05-08
CI
Tranche Update on HPSP Co., Ltd.'s Equity Buyback Plan announced on May 9, 2023.
05-08
CI
HPSP Co., Ltd.'s Equity Buyback announced on May 9, 2023, has expired with 250,000 shares, representing 0.31% for KRW 8,818.23 million.
05-07
CI
HPSP Expands Its R&D Capabilities and Study on High-Pressure Annealing and Oxidation
01-17
CI
HPSP Co., Ltd.'s Equity Buyback Plan Extended till May 8, 2024.
11-06
CI
Tranche Update on HPSP Co., Ltd.'s Equity Buyback Plan announced on May 9, 2023.
23-08-09
CI
HPSP Co., Ltd. announces an Equity Buyback for KRW 10,000 million worth of its shares.
23-05-09
CI
HPSP Co., Ltd. authorizes a Buyback Plan.
23-05-08
CI
HPSP Co., Ltd.(KOSDAQ:A403870) added to S&P Global BMI Index
22-12-19
CI
HPSP Co., Ltd. has completed an IPO in the amount of KRW 75 billion.
22-07-11
CI
HPSP Co., Ltd. has filed an IPO.
21-12-22
CI
HANMI Semiconductor Co., Ltd. agreed to acquire 12.49% stake in HPSP Co., Ltd for KRW 37.5 billion.
21-06-16
CI
Duration Auto. 2 months 3 months 6 months 9 months 1 year 2 years 5 years 10 years Max.
Period Day Week
More charts
HPSP Co Ltd is a Korea-based company principally engaged in the manufacture and sale of semiconductor equipment. The Company is principally engaged in the manufacture and sale of semiconductor equipment such as high-pressure hydrogen annealing semiconductor equipment, high pressure thermal processing systems, high pressure oxidation systems and others. In addition, the Company is also engaged in the manufacture and sale of semiconductor equipment parts as well as the provision of after service (AS).
More about the company
Last Close Price
40,400
KRW
Average target price
54,000
KRW
Spread / Average Target
+33.66%
Consensus
1st Jan change
Capi.
-10.72% 2.41B +73.90% 42.14B +48.95% 36.64B -17.18% 28.24B +30.10% 23.35B +14.22% 12.66B +181.52% 12.46B -7.92% 12.28B +54.00% 6.94B -19.39% 4.94B
Semiconductor Machinery Manufacturing
+951% of historical performance
More than 20 years at your side
Our Experts are here for you
OUR EXPERTS ARE HERE FOR YOU
Monday - Friday 9am-12pm / 2pm-6pm GMT + 1