HITACHI CHEMICAL COMPANY, LTD. 
By Hitachi Chemical Co., Ltd.
Hitachi Chemical Co., Ltd. (Head Office: Tokyo; President and
CEO: Kazuyuki Tanaka; Capital: 15.5 billion yen; hereinafter
referred to as "Hitachi Chemical") has filed a
lawsuit against INNOX Corporation (Head Office: Asan-City
Chungcheongnam-do, Korea; hereinafter referred to as
"INNOX") with the Court of Taiwan for INNOX's
infringement on Hitachi Chemical's Taiwanese patent
related to die bonding film, which is used in the
semiconductor packaging process.
Die bonding film is ultra-thin film glue that is essential to
the bonding of semiconductor chips, particularly for the
increasing prevalence and development of multi-layered chips,
and contributes to higher densification and productivity of
semiconductor packaging. Hitachi Chemical succeeded in
developing die bonding film in 1993 ahead of other companies,
and started marketing thereafter. At present, die bonding
film is the de facto standard for multi-laminate technology
in semiconductors, and its product lineup of die bonding
film, dicing die bonding film and etc., Hitachi Chemical has
the largest global market share. In the field of die bonding
film and dicing die bonding film, Hitachi Chemical has a
comprehensive patent portfolio of approximately 500 patents
(including pending patent applications) in Japan and other
countries, including but not limited to patents in connection
with the film property, material and packaging, such as
Hitachi Chemical's Taiwan Patent No. I298084.
INNOX's Product WL-0020-05A is a dicing die bonding film
manufactured by INNOX. Product analysis shows that it
comprises a base film, an adhesive layer and a bonding layer.
The adhesive layer comprises a compound that contains
intramolecular, radiation curable carbon-carbon double bonds
with an iodine value between 0.5 to 20, and a polyisocyanate
compound. The bonding layer comprises a epoxy resin, a phenol
resin with a hydroxyl equivalent higher than 150 g/eq., an
epoxy group-containing acrylic copolymer that comprises of
0.5 to 0.6% by weight of glycidyl methacrylate and with a
weight average molecular weight higher than 100,000, a
filler, and a curing accelerator. Our product analysis
demonstrates that the aforesaid product is likely to fall
within Claim 1 of Hitachi Chemical's Taiwan Patent No.
I298084. Therefore, INNOX's offer to sell and sale of the
product in Taiwan may involve infringement on Hitachi
Chemical's Taiwan Patent No. I298084.
Hitachi Chemical has sent INNOX a warning letter concerning
patent infringement based on Korean patent and further
negotiated with INNOX in April 2011; nevertheless, no
settlement was amicably reached. To protect its intellectual
property right, Hitachi Chemical thus has filed a lawsuit
against INNOX's "WL-0020" series products in
Taiwan.
Hitachi Chemical is committed to protection of its
intellectual property and will actively exercise its rights
to preserve its competitive edge in the market.
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