HB Technology CO.,LTD. announced that it expects to receive KRW 40 billion in funding
July 08, 2021
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HB Technology CO.,LTD. announced a private placement of eighth unsecured convertible bonds for gross proceeds of KRW 40,000,000,000 on July 9, 2021. The bonds will mature on August 13, 2026. The bonds are convertible into 13,726,835 common shares at conversion value of KRW 2,914 and will have an exercise period starting from August 13, 2022 to July 13, 2026. The transaction is expected to be closed on August 13, 2021 and the subscription date is July 13, 2021.
HB Technology CO.,LTD., formerly NCB NETWORKS CO.,LTD., is a Korea-based company mainly engaged in the manufacture of semiconductor inspection equipment. The Companyâs products include automated optical inspection (AOI) systems, which are used for thin film transistor liquid crystal displays (TFT LCDs), organic light-emitting diodes (OLEDs) and plasma display panels (PDPs); POL inspection systems, which are mainly used for plat films of LCD displays, and bare glass inspection systems. The Companyâs customers include SAMSUNG ELECTRONICS CO,.LTD, Samsung Mobile Display Co., Ltd., Samsung Corning Precision Materials Co., Ltd., Beijing BOE Display Technology Co., Ltd., and other display and semiconductor manufacturers. On July 8, 2013, it merged with LST, a Korea-based company mainly engaged in the manufacturing and sales of display parts. After the merger, the Company survived and LST was dissolved.
HB TECHNOLOGY CO.,LTD. 