Xiamen Silan Advanced Compound Semiconductor Co., Ltd. announced that it has signed an agreement to will raise CNY 4,150 million in an equity funding on May 20, 2024. The transaction will include participation from returning investor, Hangzhou Silan Microelectronics Co.,Ltd for CNY 1,000 million and its stake reduced from 100% to 25.1781%, new investors, Xiamen Semiconductor Investment Group Co., Ltd. for CNY 1,000 million for 23.7530% stake and Xiamen Xinyi Technology Industrial Co., Ltd. for CNY 2,150 million for 51.0689% stake. The transaction has been approved at the 24th meeting of the 8th Directorate.

The transaction is subject to the approved of the shareholders' meeting. Upon the closing, the company's registered capital will increase from CNY 60 million to CNY 4,210 million.