FORMOSA ADVANCED TECHNOLOGIES CO., LTD. Formosa Advanced Technologies Co., Ltd. Stock
Equities
8131
TW0008131004
Semiconductor Equipment & Testing
|
End-of-day quote
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|
5-day change | 1st Jan Change | ||
| 36.45 TWD | +0.41% |
|
+1.25% | -6.54% |
| Sales 2022 | 10.43B 320M 437M | Sales 2023 | 7.65B 235M 321M | Capitalization | 17.25B 529M 723M |
|---|---|---|---|---|---|
| Net income 2022 | 2.06B 63.08M 86.12M | Net income 2023 | 530M 16.27M 22.21M | EV / Sales 2022 | 1.01 x |
| Net cash position 2022 | 6.44B 198M 270M | Net cash position 2023 | 5.92B 182M 248M | EV / Sales 2023 | 1.48 x |
| P/E ratio 2022 |
8.25
x | P/E ratio 2023 |
32.5
x | Employees | 2,313 |
| Yield 2022 |
8.62% | Yield 2023 |
-
| Free-Float | 30.68% |
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| 1 day | +0.41% | ||
| 1 week | +1.25% | ||
| Current month | -0.68% | ||
| 1 month | +0.83% | ||
| 3 months | -4.83% | ||
| 6 months | -6.78% | ||
| Current year | -6.54% |
1 week
35.75
36.55
1 month
35.3537.35
Current year
35.3539.20
1 year
35.3544.55
3 years
35.0045.30
5 years
28.7045.30
10 years
15.4045.30
| Managers | Title | Age | Since |
|---|---|---|---|
| Chief Executive Officer | - | 02-01-03 | |
Hsin Jung Lin
DFI | Director of Finance/CFO | - | - |
Chung Hou Huang
CTO | Chief Tech/Sci/R&D Officer | - | 22-09-18 |
| Members of the board | Title | Age | Since |
|---|---|---|---|
Wen Yuan Wang
BRD | Director/Board Member | - | 97-03-13 |
| Director/Board Member | 76 | 20-06-18 | |
Min Chang Li
BRD | Director/Board Member | - | 90-09-10 |
| Date | Price | Change | Volume |
|---|---|---|---|
| 24-04-26 | 36.45 | +0.41% | 149,198 |
| 24-04-25 | 36.3 | 0.00% | 130,385 |
| 24-04-24 | 36.3 | +0.28% | 202,068 |
| 24-04-23 | 36.2 | +0.28% | 209,717 |
| 24-04-22 | 36.1 | +0.28% | 189,796 |
End-of-day quote Taiwan S.E., April 25, 2024
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Formosa Advanced Technologies Co., Ltd. is a Taiwan-based company principally engaged in the provision of integrated circuit (IC) assembly and related testing services and module services. The Company provides services applied in thin small outline packages (TSOPs), small outline packages (SOPs), quad flat packages (QFPs), thin quad flat packages (TQFPs), ball grid array (BGA) packages, chip probing (CP) testing, solid state disk (SSD) testing, system-in-package (SIP) testing, embedded multimedia card (eMMC) testing, as well as cutting, grinding and testing of light emitting diodes (LED) wafers, among others. The Company operates its businesses principally in Taiwan, Hong Kong and South Korea.
Calendar
2024-04-30
- Q1 2024 Earnings Release (Projected)
| 1st Jan change | Capi. | |
|---|---|---|
| -6.54% | 494M | |
| +21.50% | 95.51B | |
| +12.34% | 25.27B | |
| -8.31% | 19.53B | |
| -8.65% | 4.41B | |
| +12.49% | 3.58B | |
| -7.63% | 3.48B | |
| -22.90% | 2.53B | |
| -0.12% | 1.19B | |
| +4.73% | 1.13B |
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