Faraday Technology Corp. and United Microelectronics Corporation announced that they have produced customer system-on-chip (SoC) ICs with a density of over 300 million gates. The successful fabrication of the communication infrastructure ICs demonstrates the two companies' ability to deliver highly complex SoCs for third-party customers with lower development risk, design effort, and overall time-to-market.

The 300 million gate-count IC was built on UMC's volume production 40nm process. It will enable tremendous bandwidth for advanced communication applications that require consistently high throughput capabilities. By comparison, a standard USB 3.0 IC controller chip has 12 million gates.

The much more complex chips integrate over 100 types of IP into the design, and feature an extra large 100MB SRAM size to power next generation communication products.