CEVA, Inc. and DARPA Establish Partnership for Technology Innovation
January 05, 2021 at 07:00 am
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CEVA, Inc. announced an open licensing agreement with the U.S. Defense Advanced Research Projects Agency (DARPA) to accelerate technology innovation for DARPA programs. The partnership, as part of the DARPA Toolbox initiative, establishes an access framework under which DARPA organizations can access all of CEVA's commercially available IPs, tools and support to expedite their programs. DARPA Toolbox is a new, agency-wide effort aimed at providing open licensing opportunities with commercial technology vendors to the researchers behind DARPA programs. Through DARPA Toolbox, successful proposers will receive greater access to commercial vendors' technologies and tools via pre-negotiated, low-cost, non-production access frameworks and simplified legal terms. For commercial vendors, DARPA Toolbox will provide an opportunity to leverage the agency's forward-looking research and a chance to develop new revenue streams based on programmatic achievements developed with their technologies. CEVA, along with Arm and Verific are first wave of technology companies to sign commercial partnership agreements under DARPA Toolbox. As licensees of CEVA IP, DARPA researchers stand to benefit by having access to CEVA's processors, tools and support for technical areas that intersect with CEVA's wireless connectivity and smart sensing portfolio. Key technologies offered by CEVA under the initiative include DSPs and software for 5G baseband processing, short range connectivity, sensor fusion, computer vision, sound processing and Artificial Intelligence.
Ceva, Inc. is a licensor of silicon and software intellectual property (IP) that enables smart edge devices to connect, sense and infer data. The Company powers the connectivity, sensing, and inference in advanced smart edge products across consumer Internet of Things (IoT), mobile, automotive, infrastructure, industrial, and personal computing. Its application software IP is licensed primarily to original equipment manufacturers (OEMs) who embed it in their System on Chip (SoC) designs to enhance the user experience, and OEMs also license its hardware IP products and solutions for their SoC designs to create power-efficient, intelligent, secure, and connected devices. From Bluetooth connectivity, Wi-Fi, ultra-wide band (UWB) and fifth generation (5G) platform IP for communications, to scalable Edge AI neural processing unit (NPU) IPs, sensor fusion processors and embedded application software that make devices smarter, it has the portfolio of IP to connect, sense and infer data.