CEVA, Inc. Introduces Its Second Generation SensPro DSP family
January 12, 2021 at 07:00 am
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CEVA, Inc. introduced its 2nd generation SensPro DSP family, a hub for AI and DSP processing workloads associated with a wide range of sensors including camera, Radar, LiDAR, Time-of-Flight, microphones and inertial measurement units (IMUs). SensPro2™ builds on CEVA's industry leadership in sensor hub DSPs, delivering 6X more DSP processing for computer vision, 8X more DSP performance for Radar processing, a 2X improvement in AI inferencing, and 20% more power efficient versus its predecessor, at the same process node. The SensPro2 family has been expanded to include seven vector DSP cores, scaling in power and performance. The new entry-level cores address DSP and AI workloads requiring up to 1 TOPS AI performance and the high-end cores reach 3.2 TOPS. Each of the SensPro2 family members can be configured with application-specific instruction set architectures (ISAs) for radar, audio, computer vision and SLAM, along with parallel vector compute options for floating point and integer data types, to get the high efficiency sensor hub DSP for their specific use-case. The SensPro2 architecture adopts a range of enhancements that have increased the performance and boosted efficiency for multitasking sensing and AI use cases, such as a new low power vector DSP architecture. For automotive powertrain applications, the upgraded floating-point DSPs offer high-precision performance, addressing the electrification trend with a powerful processor. Moreover, the SensPro2 architecture and cores are automotive ready with ASIL B hardware random faults and ASIL D systematic fault certification. In terms of performance, SensPro2 is capable of delivering up to 3.2 TOPS for 8x8 networks inferencing running at 1.6GHz, and doubles the memory bandwidth from the 1st generation, to more efficiently address data-intensive fully-connected layers.
Ceva, Inc. is a licensor of silicon and software intellectual property (IP) that enables smart edge devices to connect, sense and infer data. The Company powers the connectivity, sensing, and inference in advanced smart edge products across consumer Internet of Things (IoT), mobile, automotive, infrastructure, industrial, and personal computing. Its application software IP is licensed primarily to original equipment manufacturers (OEMs) who embed it in their System on Chip (SoC) designs to enhance the user experience, and OEMs also license its hardware IP products and solutions for their SoC designs to create power-efficient, intelligent, secure, and connected devices. From Bluetooth connectivity, Wi-Fi, ultra-wide band (UWB) and fifth generation (5G) platform IP for communications, to scalable Edge AI neural processing unit (NPU) IPs, sensor fusion processors and embedded application software that make devices smarter, it has the portfolio of IP to connect, sense and infer data.