Camtek Ltd. announced that it received multiple orders, most of them for multiple systems, totaling 17 tools, for its Next Generation systems for the 3D metrology and measurement of bumps in the Advanced Packaging market. The orders were received by Camtek from multiple tier-1 customers in recent weeks. Most of the tools are expected to be installed in the first half of 2018. These orders follow the initial market introduction of Camtek's Next Generation 3D Metrology system which was launched at Semicon Taiwan in September 2017 and has already been qualified by some of Camtek's major customers.