Network origin in Marcus Crayon first degree
| Entity | Entity type | Industry | |
|---|---|---|---|
FlipChip International LLC
 FlipChip International LLC SemiconductorsElectronic Technology FlipChip International LLC provides wafer bumping and wafer level packaging semiconductor services. The firm’s services include wafer level services, probing, backgrind, decing, packing, solder alloy, and many more. It also offers wafer thinning, electrical test, and dicing. The company was founded in 1996 and is headquartered in Phoenix, AZ.
4
| Subsidiary | Semiconductors | 4 |
Chart of Companies connected to the second degree
Multi-company connection
Companies connected to Marcus Crayon via their personal network
| Company | Sector | Related people | Main position |
|---|---|---|---|
| FTC SOLAR, INC. | Packaged Software | Corporate Officer/Principal | |
| SUNEDISON INC | Alternative Power Generation | Corporate Officer/Principal | |
AGC Multi Material America, Inc.
 AGC Multi Material America, Inc. Electronic ComponentsElectronic Technology Part of AGC, Inc. (Japan), AGC Multi Material America, Inc. manufactures and markets printed circuit materials. The company is based in Tempe, AZ. | Electronic Components | President |
Statistics
International
| United States | 4 |
Sectoral
| Technology Services | 2 |
| Utilities | 2 |
| Electronic Technology | 2 |
Operational
| Sales & Marketing | 2 |
| President | 2 |
| Corporate Officer/Principal | 2 |
| Director of Finance/CFO | 1 |
| Chief Operating Officer | 1 |
Most connected contacts
| Insiders | |
|---|---|
| Jay B. Grover | 4 |
| Fred Hickman | 1 |
| David McComb | 1 |
| Greg Marshall | 1 |
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