![Lars A. Pedersen](https://cdn.zonebourse.com/static/resize/768/576//static/images/insiders/unknown.png)
Lars A. Pedersen
Chief Tech/Sci/R&D Officer at TPACK A/S
Profile
Lars A.
Pedersen is currently the Chief Technology Officer at TPACK A.
Previously, he worked as a Principal at Infinera Optical Holding, Inc. and DSC Communications Corp.
Mr. Pedersen received an undergraduate degree from Copenhagen Business School and a graduate degree from Technical University of Denmark.
Lars A. Pedersen active positions
Companies | Position | Start |
---|---|---|
TPACK A/S
![]() TPACK A/S Packaged SoftwareTechnology Services TPACK provides SOFTSILICON solutions to Telecom Equipment Manufacturers that enable them to build systems faster and with lower risk, but also allowing new functionality to be added both during development and in the field. Since 2001, TPACK has been providing some of the world's largest telecommunication equipment manufacturers with leading edge technology and solutions for efficient packet transport. Specifically, TPACK provides the chip solutions and the supporting software that implement the intelligence in telecom systems. TPACK's experience and expertise in both data and telecom networks has proven to be decisive in TPACK's success to date. | Chief Tech/Sci/R&D Officer | - |
Former positions of Lars A. Pedersen
Companies | Position | End |
---|---|---|
TELLABS, INC. | Corporate Officer/Principal | - |
DSC Communications Corp. | Corporate Officer/Principal | - |
Training of Lars A. Pedersen
Technical University of Denmark | Graduate Degree |
Copenhagen Business School | Undergraduate Degree |
Experiences
Positions held
Connections
1st degree connections
1st degree companies
Male
Female
Members of the board
Executives
Linked companies
Private companies | 3 |
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TPACK A/S
![]() TPACK A/S Packaged SoftwareTechnology Services TPACK provides SOFTSILICON solutions to Telecom Equipment Manufacturers that enable them to build systems faster and with lower risk, but also allowing new functionality to be added both during development and in the field. Since 2001, TPACK has been providing some of the world's largest telecommunication equipment manufacturers with leading edge technology and solutions for efficient packet transport. Specifically, TPACK provides the chip solutions and the supporting software that implement the intelligence in telecom systems. TPACK's experience and expertise in both data and telecom networks has proven to be decisive in TPACK's success to date. | Technology Services |
DSC Communications Corp. | Electronic Technology |
Infinera Optical Holding, Inc.
![]() Infinera Optical Holding, Inc. Telecommunications EquipmentElectronic Technology Infinera Optical Holding, Inc. designs and develops telecommunications networking products. The firm serves telecom service providers, independent operating companies, multiple system operator cable companies, enterprises and government agencies. The company was founded by Michael J. Birck in 1975 and is headquartered in Naperville, IL. | Electronic Technology |
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