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Jin Aun Lew
Chairman at Selangor Human Resources Development Centre
Net worth: 514 568 $ as of 2024-05-30
Jin Aun Lew active positions
Companies | Position | Start | End |
---|---|---|---|
Selangor Human Resources Development Centre | Chairman | - | - |
Career history of Jin Aun Lew
Former positions of Jin Aun Lew
Companies | Position | Start | End |
---|---|---|---|
JF TECHNOLOGY | Director/Board Member | 2009-01-01 | 2022-11-30 |
Independent Dir/Board Member | 2009-01-01 | 2022-11-30 | |
STATS CHIPPAC LTD. | Chief Executive Officer | - | - |
Motorola Solutions Malaysia Sdn. Bhd.
![]() Motorola Solutions Malaysia Sdn. Bhd. Telecommunications EquipmentElectronic Technology Part of Motorola Solutions, Inc., Motorola Solutions Malaysia Sdn. The company is based in Petaling Jaya, Malaysia. Bhd. is a Malaysian company that manufactures communication devices and equipment. | Chief Executive Officer | - | - |
Training of Jin Aun Lew
University of Malaya | Undergraduate Degree |
University of Bath | Masters Business Admin |
Statistics
International
Malaysia | 5 |
Singapore | 2 |
United Kingdom | 2 |
Operational
Chief Executive Officer | 2 |
Director/Board Member | 1 |
Independent Dir/Board Member | 1 |
Sectoral
Electronic Technology | 4 |
Consumer Services | 3 |
Positions held
Active
Inactive
Listed companies
Private companies
Linked companies
Listed companies | 1 |
---|---|
JF TECHNOLOGY | Electronic Technology |
Private companies | 3 |
---|---|
Selangor Human Resources Development Centre | |
Motorola Solutions Malaysia Sdn. Bhd.
![]() Motorola Solutions Malaysia Sdn. Bhd. Telecommunications EquipmentElectronic Technology Part of Motorola Solutions, Inc., Motorola Solutions Malaysia Sdn. The company is based in Petaling Jaya, Malaysia. Bhd. is a Malaysian company that manufactures communication devices and equipment. | Electronic Technology |
STATS ChipPAC Pte Ltd.
![]() STATS ChipPAC Pte Ltd. Electronic Equipment/InstrumentsElectronic Technology STATS ChipPAC Pte Ltd. engages in the provision of semiconductor test and packaging services. Its services includes design, characterization, and wafer bumping.The company was founded by June Lihan Chia in 1994 and is headquartered in Singapore. | Electronic Technology |
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