Laser Tek Taiwan Co.,Ltd.

Equities

6207

TW0006207004

Semiconductor Equipment & Testing

End-of-day quote Taipei Exchange Other stock markets 18:00:00 2024-06-20 EDT			5-day change	1st Jan Change
74 ^TWD	-2.63%		+4.08%	+127.69%

06-05	Laser Tek Taiwan Co.,Ltd. Announces Cash Dividend or the Year 2023, Payable on June 26, 2024	CI
05-14	Laser Tek Taiwan Co.,Ltd. Reports Earnings Results for the First Quarter Ended March 31, 2024	CI

Laser Tek Taiwan Co.,Ltd. Announces Cash Dividend or the Year 2023, Payable on June 26, 2024

June 04, 2024 at 10:57 pm

Laser Tek Taiwan Co.,Ltd. announced that cash dividends is TWD 119,519,865(TWD 1.5 per share) for the year 2023. Ex-rights (Ex-dividend) date: June 21, 2024. Ex-rights (Ex-dividend) record date: June 29, 2024.

Payment date of cash dividend distribution is June 26, 2024.

Latest news about Laser Tek Taiwan Co.,Ltd.

Laser Tek Taiwan Co.,Ltd. Announces Cash Dividend or the Year 2023, Payable on June 26, 2024	06-04	CI
Laser Tek Taiwan Co.,Ltd. Reports Earnings Results for the First Quarter Ended March 31, 2024	05-13	CI
Laser Tek Taiwan Co.,Ltd. Reports Earnings Results for the Full Year Ended December 31, 2023	03-24	CI
Laser Tek Taiwan Co.,Ltd. Reports Earnings Results for the Third Quarter and Nine Months Ended September 30, 2023	11-12	CI
Laser Tek Taiwan Co.,Ltd. Reports Earnings Results for the Second Quarter and Six Months Ended June 30, 2023	23-08-09	CI
Laser Tek Taiwan Co.,Ltd. Reports Earnings Results for the First Quarter Ended March 31, 2023	23-05-15	CI
Laser Tek Taiwan Co.,Ltd. Reports Earnings Results for the Full Year Ended December 31, 2022	23-03-30	CI
Laser Tek Taiwan Co.,Ltd Reports Earnings Results for the Third Quarter and Nine Months Ended September 30, 2022	22-11-09	CI
Laser Tek Taiwan Co.,Ltd Reports Earnings Results for the Second Quarter and Six Months Ended June 30, 2022	22-08-11	CI
Laser Tek Taiwan Co.,Ltd Reports Earnings Results for the First Quarter Ended March 31, 2022	22-05-11	CI
Laser Tek Taiwan Co.,Ltd Reports Earnings Results for the Full Year Ended December 31, 2021	22-03-25	CI
Laser Tek Taiwan Co.,Ltd Reports Earnings Results for the Third Quarter and Nine Months Ended September 30, 2021	21-11-09	CI
Laser Tek Taiwan Co.,Ltd Reports Earnings Results for the Second Quarter Ended June 30, 2021	21-08-12	CI
Laser Tek Taiwan Co.,Ltd Reports Earnings Results for the First Quarter Ended March 31, 2021	21-05-13	CI
Laser Tek Taiwan Co.,Ltd Reports Earnings Results for the Full Year Ended December 31, 2020	21-03-29	CI
Laser Tek Taiwan Co.,Ltd Reports Earnings Results for the Third Quarter Ended September 30, 2020	20-11-11	CI
Laser Tek Taiwan Co.,Ltd Reports Earnings Results for the Second Quarter Ended June 30, 2020	20-08-11	CI
Laser Tek Taiwan Co.,Ltd Reports Earnings Results for the First Quarter Ended March 31, 2020	20-05-12	CI
Laser Tek Taiwan Co.,Ltd Reports Earnings Results for the Full Year Ended December 31, 2019	20-03-26	CI
Laser Tek Taiwan Co.,Ltd Reports Earnings Results for the Third Quarter Ended September 30, 2019	19-11-10	CI
Laser Tek Taiwan Co.,Ltd(GTSM:6207) dropped from S&P Global BMI Index	19-09-23	CI
Laser Tek Taiwan Co.,Ltd Reports Earnings Results for the Second Quarter Ended June 30, 2019	19-08-08	CI
Laser Tek Taiwan Co.,Ltd Reports Earnings Results for the First Quarter Ended March 31, 2019	19-05-12	CI
Laser Tek Taiwan Co.,Ltd Reports Earnings Results for the Full Year Ended December 31, 2018	19-03-28	CI
Laser Tek Taiwan Co.,Ltd Reports Earnings Results for the Third Quarter Ended September 30, 2018	18-11-11	CI

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Company Profile

LASER TEK TAIWAN CO., LTD. is a Taiwan-based company principally engaged in the manufacturing and sales of passive components. The Company mainly operated through four business segments. The Surface Mounted Devices (SMDs) segment is mainly engaged in the manufacturing, processing and sales of passive components wafer packaging materials, active components plastic packaging materials and related electronic components and spare parts. The Equipment segment is mainly engaged in the sales and maintenance of testing equipment, optical equipment, printing equipment and related components of surface mount technology (SMT), as well as the research and development, manufacture and sales of laser applications equipment and parts. The Wafer Testing and Packaging segment is engaged in the testing and packaging of passive components wafers. The Others segment is mainly engaged in the sales of other electronic products and energy products.

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Semiconductor Equipment & Testing

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