Hi Sharp Electronics Co., Ltd. (GTSM:3128) announced a private placement of 1,000 domestic secured convertible bonds at TWD 100,000 per bond for gross proceeds of TWD 100,000,000 on November 29, 2013. The bonds will be issued at its par value and will have a term of three years and a coupon rate of 0%.

On February 21, 2014, the company announced that the bonds to be issued in first tranche are convertible into common shares of the company at TWD 17.10 per share.