Ansys is helping engineering teams to mesh and solve larger designs than ever with the launch of Ansys HFSS Mesh Fusion. Cutting development expenses and expediting the development of products, HFSS Mesh Fusion drives rapid and fully coupled simulation of complex EM systems — without compromising the design or fidelity. Modern electronic products are more sophisticated than ever, with higher density, lower voltage margins and more advanced processes. To deliver innovation, engineers must increase functionality and maintain or even decrease power consumption within a smaller form factor. As these designs become more challenging, engineers must solve complex interactions between components and across systems, critical for designing cutting-edge artificial intelligence machine learning, autonomous vehicle, 5G communications, high-performance computing and Industrial Internet of Things applications. HFSS Mesh Fusion, available in Ansys HFSS 2021 R1, helps engineers combine integrated circuits (IC), packaging, connectors, printed circuit boards, antennas and platform in a single Ansys HFSS analysis to predict EM interactions. HFSS Mesh Fusion bypasses previous barriers by applying optimal meshing technology at the component level, parallelized across cores, clusters or within Ansys® Cloud™. A breakthrough solver technology then extracts a fully coupled, uncompromised, full-wave EM matrix. By enabling much more complex designs to be solved, companies can confidently push the limits of performance to create state-of-the-art products. HFSS Mesh Fusion helps engineers swiftly overcome the most challenging design obstacles to deliver best-in-class products to customers.