Shanghai Xingsi Semiconductor Co., Ltd. announced that it has signed the agreement to receive funding on April 1, 2024. The transaction will include participation from returning investor Anhui Landun Photoelectron Co., Ltd. or CNY 180 million for 5.0935% stakes, existing shareholders and other investors. The transaction has been been reviewed and approved by the 12th meeting of the 6th Board of Directors.
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5-day change | 1st Jan Change | ||
22.76 CNY | +1.52% |
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-12.80% | -24.56% |
06-06 | Anhui Landun Photoelectron Co., Ltd. Announces Dividend on Share A for the Year 2023, Payable on June 14, 2024 | CI |
05-14 | Anhui Landun Photoelectron Co., Ltd. Approves Cash Dividend for 2023 | CI |
1st Jan change | Capi. | |
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-24.56% | 578M | |
+0.77% | 30.43B | |
+26.94% | 8.77B | |
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+20.72% | 5.48B | |
+13.27% | 3.71B | |
-19.32% | 3.46B | |
+3.41% | 3.4B | |
+17.68% | 3.38B | |
-10.25% | 2.7B |
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- Shanghai Xingsi Semiconductor Co., Ltd. announced that it expects to receive funding from Anhui Landun Photoelectron Co., Ltd. and other investors