Aehr Test Systems Announces Unaudited Consolidated Earnings Results for the Second Quarter and Six Months Ended November 30, 2016
January 05, 2017 at 04:01 pm
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Aehr Test Systems announced unaudited consolidated earnings results for the second quarter and six months ended November 30, 2016. For the quarter, the company reported net sales of $4.2 million, compared to $4.6 million in the second quarter of fiscal 2016. GAAP net loss was $1.5 million, or $0.09 per diluted share, compared to a GAAP net loss of $1.0 million, or $0.08 per diluted share, in the same quarter a year ago. Non-GAAP net loss was $1.2 million, or $0.08 per diluted share, compared to a non-GAAP net loss of $794,000, or $0.06 per diluted share, in the same quarter a year ago. Loss from operations was $1,284,000 compared to $945,000 a year ago. Loss before income tax expense was $1,422,000 compared to $1,027,000 a year ago. Net loss attributable to company common shareholders was $1,452,000 compared to $1,048,000 a year ago.
For the six months, the company's net sales were $9.5 million, compared to $11.3 million in the first six months of fiscal 2016. GAAP net loss was $2.2 million, or $0.15 per diluted share, compared to a GAAP net loss of $754,000, or $0.06 per diluted share, in the same period a year ago. Non-GAAP net loss was $1.7 million, or $0.11 per diluted share, compared to a non-GAAP net loss of $181,000, or $0.01 per diluted share, in the same period a year ago. Loss from operations was $1,854,000 compared to $469,000 a year ago. Loss before income tax expense was $2,173,000 compared to $710,000 a year ago. Net loss attributable to company common shareholders was $2,207,000 compared to $754,000 a year ago.
Aehr Test Systems is a provider of test solutions for testing, burning-in, and stabilizing semiconductor devices in wafer level, singulated die, and package part form. The Company's products include the FOX-P family of test and burn-in systems and FOX WaferPak Aligner, FOX WaferPak Contactor, FOX DiePak Carrier and FOX DiePak Loader. The FOX-XP and FOX-NP systems are full wafer contact and singulated die/module test and burn-in systems that can test, burn-in, and stabilize a range of devices such as silicon carbide-based and other power semiconductors, 2D and 3D sensors used in mobile phones, tablets, and other computing devices. The FOX-CP system is a low-cost single-wafer compact test solution for logic, memory and photonic devices. The FOX WaferPak Contactor contains a full wafer contactor capable of testing wafers up to 300 millimeter (mm) that enables integrated circuit (IC) manufacturers to perform testing, burn-in, and stabilization of full wafers on the FOX-P systems.