Network origin in Osamu Okada first degree
| Entity | Entity type | Industry | |
|---|---|---|---|
Casio Micronics Co., Ltd.
 Casio Micronics Co., Ltd. SemiconductorsElectronic Technology Since its founding in 1987, Casio Micronics has been engaged in the development of wafer bump forming technology and the provision of wafer bumping services. Casio Micronics is committed along with its partners and collaborating companies to assisting customers in the areas of related testing, dicing, tape & reel, device control, substrate embedding, modularization, design and other technologies and business areas. Furthermore, for the protection of the global environment, Casio Micronics also aims to contribute to the development of embedded wafer level package (EWLP) technology, in order to realize solderless mounting, which is an energy conservation theme in the mounting industry.
4
| Subsidiary | Semiconductors | 4 |
Chart of Companies connected to the second degree
Multi-company connection
Companies connected to Osamu Okada via their personal network
| Company | Sector | Related people | Main position |
|---|---|---|---|
| CASIO COMPUTER CO., LTD. | Electronics/Appliances | Director/Board Member |
Statistics
International
| Japan | 2 |
Sectoral
| Consumer Durables | 2 |
Operational
| Director/Board Member | 5 |
| Corporate Officer/Principal | 2 |
| President | 1 |
| Independent Dir/Board Member | 1 |
| Chief Administrative Officer | 1 |
Most connected contacts
- Stock Market
- Insiders
- Osamu Okada
- Company connections
