![Kathy Cook](https://cdn.zonebourse.com/static/resize/768/576//static/images/insiders/unknown.png)
Kathy Cook
Corporate Officer/Principal at Invensas Bonding Technologies, Inc.
Profile
Kathy Cook is currently the Director of Business Development at Invensas Bonding Technologies, Inc. She previously worked as an Engineer & Supplier at Applied Materials, Inc. and as a Regional Sales Engineer at EMD Millipore Corp.
She also worked as a Principal at ULVAC Technologies, Inc. and as a Sales Manager-Wafer Bonders at SUSS Microtec, Inc. Ms. Cook holds a graduate degree from Auburn University and an undergraduate degree from The University of Texas at Austin.
Kathy Cook active positions
Companies | Position | Start |
---|---|---|
Invensas Bonding Technologies, Inc.
![]() Invensas Bonding Technologies, Inc. SemiconductorsElectronic Technology Invensas Bonding Technologies, Inc. is a holding company, which engages in the design and development of semiconductor integration technology. It helps lower manufacturing and packaging costs and as well as increase yield associated with the manufacturing of Backside Illuminated (BSI) CMOS image sensors (IS), high-speed logic, stacked memory and memory-on-processor. Its technologies are enabling the creation of true 3D integrated circuits (ICs) at the gate level by delivering advantages including: reduced silicon cost, size reduction, reduced NRE, shorter time-to-market, lower power consumption, and increased system speed and performance. The company was founded in October 2000 and is headquartered in Raleigh, NC. | Corporate Officer/Principal | 2011-03-30 |
Former positions of Kathy Cook
Companies | Position | End |
---|---|---|
SUSS Microtec, Inc.
![]() SUSS Microtec, Inc. SemiconductorsElectronic Technology SUSS Microtec, Inc. supplies precision technology products. It provides innovative solutions for markets including advanced packaging, MEMS, Nanotechnology, compound semiconductor, silicon-on-insulator and 3D Interconnect. The company also manufactures a complete line of photoresist and dielectric coat/bake/develop systems, microlithography exposure systems, wafer and device bonders, probers, photomasks, cleaners, and etchers. It was founded by Karl Süss in 1949 and is headquartered in Waterbury Center, VT. | Sales & Marketing | - |
EMD Millipore Corp.
![]() EMD Millipore Corp. Miscellaneous Commercial ServicesCommercial Services EMD Millipore Corp. engages in the provision of laboratory materials, technologies, and services to the life science industry. The company was founded by Jack Bush in 1954 and is headquartered in Burlington, MA. | Sales & Marketing | - |
ULVAC Technologies, Inc.
![]() ULVAC Technologies, Inc. SemiconductorsElectronic Technology ULVAC Technologies, Inc. designs, manufactures and markets equipment and materials for industrial applications. It offers heliot repair, vacuum pump repair, shield cleaning, nano metal inks, and refurbished equipment. The company was founded in 1992 and is headquartered in Methuen, MA. | Corporate Officer/Principal | - |
APPLIED MATERIALS, INC. | Corporate Officer/Principal | - |
Training of Kathy Cook
Auburn University | Graduate Degree |
The University of Texas at Austin | Undergraduate Degree |
Experiences
Positions held
Connections
1st degree connections
1st degree companies
Male
Female
Members of the board
Executives
Linked companies
Listed companies | 1 |
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APPLIED MATERIALS, INC. | Producer Manufacturing |
Private companies | 4 |
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EMD Millipore Corp.
![]() EMD Millipore Corp. Miscellaneous Commercial ServicesCommercial Services EMD Millipore Corp. engages in the provision of laboratory materials, technologies, and services to the life science industry. The company was founded by Jack Bush in 1954 and is headquartered in Burlington, MA. | Commercial Services |
Invensas Bonding Technologies, Inc.
![]() Invensas Bonding Technologies, Inc. SemiconductorsElectronic Technology Invensas Bonding Technologies, Inc. is a holding company, which engages in the design and development of semiconductor integration technology. It helps lower manufacturing and packaging costs and as well as increase yield associated with the manufacturing of Backside Illuminated (BSI) CMOS image sensors (IS), high-speed logic, stacked memory and memory-on-processor. Its technologies are enabling the creation of true 3D integrated circuits (ICs) at the gate level by delivering advantages including: reduced silicon cost, size reduction, reduced NRE, shorter time-to-market, lower power consumption, and increased system speed and performance. The company was founded in October 2000 and is headquartered in Raleigh, NC. | Electronic Technology |
ULVAC Technologies, Inc.
![]() ULVAC Technologies, Inc. SemiconductorsElectronic Technology ULVAC Technologies, Inc. designs, manufactures and markets equipment and materials for industrial applications. It offers heliot repair, vacuum pump repair, shield cleaning, nano metal inks, and refurbished equipment. The company was founded in 1992 and is headquartered in Methuen, MA. | Electronic Technology |
SUSS Microtec, Inc.
![]() SUSS Microtec, Inc. SemiconductorsElectronic Technology SUSS Microtec, Inc. supplies precision technology products. It provides innovative solutions for markets including advanced packaging, MEMS, Nanotechnology, compound semiconductor, silicon-on-insulator and 3D Interconnect. The company also manufactures a complete line of photoresist and dielectric coat/bake/develop systems, microlithography exposure systems, wafer and device bonders, probers, photomasks, cleaners, and etchers. It was founded by Karl Süss in 1949 and is headquartered in Waterbury Center, VT. | Electronic Technology |
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