Career history of Jay B. Grover
Former positions of Jay B. Grover
| Companies | Position | Start | End |
|---|---|---|---|
| FTC SOLAR, INC. | Corporate Officer/Principal | 2019-04-30 | 2021-08-26 |
| SUNEDISON INC | Corporate Officer/Principal | 2009-12-31 | 2016-12-31 |
FlipChip International LLC
 FlipChip International LLC SemiconductorsElectronic Technology FlipChip International LLC provides wafer bumping and wafer level packaging semiconductor services. The firm’s services include wafer level services, probing, backgrind, decing, packing, solder alloy, and many more. It also offers wafer thinning, electrical test, and dicing. The company was founded in 1996 and is headquartered in Phoenix, AZ. | Chief Operating Officer | 2004-12-31 | 2009-12-31 |
AGC Multi Material America, Inc.
 AGC Multi Material America, Inc. Electronic ComponentsElectronic Technology Part of AGC, Inc. (Japan), AGC Multi Material America, Inc. manufactures and markets printed circuit materials. The company is based in Tempe, AZ. | President | 1996-12-31 | 2004-12-31 |
Statistics
International
| United States | 5 |
Operational
| Corporate Officer/Principal | 2 |
| Chief Operating Officer | 1 |
| President | 1 |
Sectoral
| Electronic Technology | 3 |
| Technology Services | 2 |
| Utilities | 2 |
Positions held
Active
Inactive
Listed companies
Private companies
Linked companies
| Listed companies | 1 |
|---|---|
| FTC SOLAR, INC. | Technology Services |
| Private companies | 3 |
|---|---|
SunEdison, Inc.
 SunEdison, Inc. Alternative Power GenerationUtilities SunEdison, Inc. engages in the provision of renewable-energy services. The company was founded on August 6, 1959 and is headquartered in Maryland Beltsville, MD. | Utilities |
FlipChip International LLC
FlipChip International LLC SemiconductorsElectronic Technology FlipChip International LLC provides wafer bumping and wafer level packaging semiconductor services. The firm’s services include wafer level services, probing, backgrind, decing, packing, solder alloy, and many more. It also offers wafer thinning, electrical test, and dicing. The company was founded in 1996 and is headquartered in Phoenix, AZ. | Electronic Technology |
AGC Multi Material America, Inc.
AGC Multi Material America, Inc. Electronic ComponentsElectronic Technology Part of AGC, Inc. (Japan), AGC Multi Material America, Inc. manufactures and markets printed circuit materials. The company is based in Tempe, AZ. | Electronic Technology |
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