Inactive Instrument

ThinFlex Corporation Stock

Equities

3144

TW0003144002

Semiconductors

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ThinFlex Corporation announced that it expects to receive ¥2.3 billion in funding from Arisawa Mfg. Co., Ltd. CI
ThinFlex Corporation Reports Earnings Results for the Third Quarter and Nine Months Ended September 30, 2021 CI
Thinflex Corporation Reports Earnings Results for the Second Quarter Ended June 30, 2021 CI
ThinFlex Corporation Announces Change of Remuneration Committee CI
Arisawa Mfg. Co., Ltd. entered into share transfer agreement to acquire remaining 10.5% stake in ThinFlex Corporation for approximately TWD 410 million. CI
ThinFlex Corporation Appoints Chen,Chun-Sheng as Member of Audit Committee CI
ThinFlex Corporation Announces Board Appointments CI
ThinFlex Corporation Appoints Chan,Cheng-Huang to Remuneration Committee, Effective May 11,2021 CI
Thinflex Corporation Reports Earnings Results for the First Quarter Ended March 31, 2021 CI
ThinFlex Corporation Appoints Liu, Chin-Hung as Chairman CI
ThinFlex Corporation Announces the Resignation of Chia-Neng Huang as Natural-Person Director of the Company CI
ThinFlex Corporation Announces Resignation of Huang, Chia-Neng as Chairperson CI
Thinflex Corporation Announces Resignation of Chief Internal Auditor CI
Thinflex Corporation Reports Earnings Results for the Full Year Ended December 31, 2020 CI
ThinFlex Corporation Announces Resignation of Chen Li Ming as Independent Director, Member of Audit Committee and Remuneration Committee, Effective May 9, 2021 CI
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Managers TitleAgeSince
Chief Executive Officer - 16-12-13
Director of Finance/CFO - 10-05-10
Chief Tech/Sci/R&D Officer - 15-03-31
Members of the board TitleAgeSince
Chairman 66 09-01-20
Director/Board Member 81 09-12-03
Director/Board Member - 03-05-12
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ThinFlex Corporation is a Taiwan-based company principally engaged in the manufacture and distribution of flexible copper clad laminates (FCCLs) and related materials. The Company provides FCCLs, which are mainly applied in the manufacture of mobile phones, medical equipment, aerospace products, liquid crystal display (LCD) panels, cameras, printers, facsimile machines, photocopiers, computers, disk players, industrial equipment and scanners, among others, as well as coverlays, which are mainly applied in the manufacture of cameras, notebook computers, handheld computers, printers, scanners, and mobile phones, among others. It distributes its products in domestic market, and the rest of Asia and Europe markets.
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