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09-30	Renesas Electronics Corporation Launches Tp65h020g4plsgbd 650V Gan Device with Dual-Side Cooling for High-Density Power Conversion in 800V Hvdc Ai Data Center Architectures	CI
09-24	Renesas Electronics Corporation Announces SLG46801 GreenPAK Configurable Mixed-Signal Device	CI

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09-30	Renesas Electronics Corporation Launches Tp65h020g4plsgbd 650V Gan Device with Dual-Side Cooling for High-Density Power Conversion in 800V Hvdc Ai Data Center Architectures	CI
09-30	Renesas Unveils Industry's First 650V GaN in Dual-Side Cooled 8x8mm Package for Megawatt-Scale AI Data Centers	BU
09-24	Renesas Electronics Corporation Announces SLG46801 GreenPAK Configurable Mixed-Signal Device	CI
09-24	Renesas Introduces Smallest Configurable GreenPAK IC with Multi-Time Programmability in Ultra-Compact WLCSP and STQFN Packages	BU
09-22	Mouser Now Shipping New Renesas RA0E3 Microcontrollers for Consumer and Industrial Applications	AQ
09-10	Renesas Electronics Corporation Launches 64-Bit RZ/G3L And RZ/G3SE MPUs For Advanced HMI And IoT Edge Systems	CI
09-10	Renesas Launches 64-bit RZ/G3L and RZ/G3SE MPUs for Advanced HMI and IoT Edge Systems	BU
09-01	Autoware Foundation and Renesas Electronics Corporation Partner to Accelerate Production-Ready End-To-End AI for ADAS and Autonomous Driving	CI
08-27	Renesas Electronics Corporation Establishes Physical AI & Robotics Lab in Beijing to Accelerate Next-Generation Robotics Innovation	CI
08-26	Renesas Establishes Physical AI & Robotics Lab in Beijing to Accelerate Next-Generation Robotics Innovation	BU
08-19	Renesas' 2025 Business & Sustainability Report: Turning Policy into Action	PU
08-03	Renesas to Phase Out Production at Takasaki Factory; Maintain and Strengthen R&D Functions	AQ
07-31	Renesas Electronics Corporation, Q2 2026 Earnings Call, Jul 31, 2026
07-31	Renesas Electronics : Earnings Report for the 2nd quarter ended June 30, 2026	PU
07-31	Renesas Electronics Corporation Reports Earnings Results for the Second Quarter and Six Months Ended June 30, 2026	CI
07-31	Renesas Electronics Turns to Profit in Fiscal H1	MT
07-31	Renesas to Phase Out Production at Takasaki Factory; Maintain and Strengthen R&D Functions	BU
07-31	Renesas Reports Financial Results for the Second Quarter Ended June 30, 2026	BU
07-31	Notice Concerning the Recording of Finance Income	BU
07-31	Renesas Announces Consolidated Forecasts	BU
07-30	Renesas Electronics Corporation Announces Third-Generation DDR5 MRDIMM Chipset Solutions	CI
07-30	Renesas Gen 3 MRDIMM Chipset Solutions Advance DDR5 Memory Performance to 16,000 MT/s for Next-Gen AI and HPC Applications	BU
07-29	Renesas Electronics : Gen 3 MRDIMM Chipset Solutions Advance DDR5 Memory Performance to 16,000 MT/s for Next-Gen AI and HPC Applications	PU
07-03	Fitch Revises Outlook on Renesas Electronics to Stable	MT
07-01	Notice Regarding Completion of Business Transfer of Consolidated Subsidiary	BU