Valuation : ChipMOS TECHNOLOGIES INC.

Market Cap 63.07B 1.99B 1.72B 1.61B 1.47B 2.76B 188B 2.77B 19.07B 7.4B 96.57B 7.49B 7.32B 311B P/E 2026 *
19.4x
P/E 2027 * 13.6x
Enterprise Value 67.93B 2.15B 1.85B 1.74B 1.59B 2.97B 203B 2.98B 20.54B 7.97B 104B 8.06B 7.89B 335B EV / Sales 2026 *
2.24x
EV / Sales 2027 * 2.02x
Free-Float
77.34%
Yield 2026 *
2.43%
Yield 2027 * 3.91%
1 day+2.18%
1 week+3.89%
Current month+5.44%
1 month+12.92%
3 months-0.09%
6 months+49.21%
Current year+94.43%
1 week 54.25
Extreme 54.25
57.82
1 month 52
Extreme 52
60.06
Current year 29.7
Extreme 29.7
78.35
1 year 17.53
Extreme 17.53
78.35
3 years 12.78
Extreme 12.7827
78.35
5 years 12.78
Extreme 12.7827
78.35
10 years 12.26
Extreme 12.26
78.35
Manager TitleAgeSince
Chief Executive Officer 67 1997-07-16
Director of Finance/CFO 54 2017-09-30
Chief Operating Officer - 2012-03-05
Director TitleAgeSince
Chairman 67 1997-07-16
Director/Board Member 69 2007-06-27
Director/Board Member 70 2013-06-16
Change 5-day change 1-year change 3-year change Capi.($)
+2.18%+3.89% - - 1.99B
+3.09%-1.81%+122.27%+136.91% 655B
+5.12%+1.90%+198.83%+339.02% 385B
+0.04%-5.18%+163.44%+145.77% 155B
-0.17%-5.31%+276.92%+396.20% 81.73B
-3.94%-2.65% - - 34.45B
+6.15%+2.83%+69.24%+37.43% 21.2B
-1.51%-4.21%+112.08%+47.96% 19.06B
+0.58%-4.99%+141.18%+253.24% 15.79B
+6.16%-1.03%+157.53%+99.74% 13.15B
Average +1.77%-3.66%+155.19%+182.03% 153.4B
Weighted average by Cap. +2.93%-1.28%+157.89%+209.65%

Financials

2026 *2027 *
Net sales 30.3B 958M 824M 775M 708M 1.32B 90.41B 1.33B 9.16B 3.55B 46.39B 3.6B 3.52B 149B 35.27B 1.11B 959M 902M 824M 1.54B 105B 1.55B 10.66B 4.14B 54B 4.19B 4.09B 174B
Net income 3.28B 104M 89.2M 83.93M 76.67M 143M 9.79B 144M 992M 385M 5.02B 389M 381M 16.18B 4.7B 148M 128M 120M 110M 205M 14.02B 206M 1.42B 551M 7.19B 557M 545M 23.17B
Net Debt 4.86B 154M 132M 124M 114M 213M 14.52B 213M 1.47B 571M 7.45B 577M 565M 23.99B 8.02B 253M 218M 205M 187M 351M 23.93B 352M 2.42B 941M 12.28B 952M 931M 39.55B
Logo ChipMOS TECHNOLOGIES INC.
ChipMOS Technologies Inc is a Taiwan-based company mainly engaged in the integrated circuits (IC) packaging and testing business. The company's major products and services include multi-chip packaging, thin small-outline packages (TSOP), ball grid array (BGA) packaging and chip on film (COF) packaging services, as well as wafer bumping, wafer-level chip-size packaging, and wafer-overpackaging technologies. The Company's packaged and tested products are mainly used in automotive, information, communication, mobile phone, wearable and consumer electronics related products. The Company also provides customers with full-stage processing and distribution services. The Company mainly operates its businesses within domestic market and overseas markets, including the rest of Asia and the Americas.
Employees
5,688
Date Price Change Volume
26-09-04 US$57.61 +2.18% 76,200
26-09-03 US$56.38 +0.41% 42,152
26-09-02 US$56.15 -1.96% 56,117
26-09-01 US$57.27 +4.81% 78,702
26-08-31 US$54.64 -1.47% 79,661
Trader
Investor
-
Global
-
Quality
-
ESG MSCI
-
Sell
Consensus
Buy
Mean consensus
BUY
Number of Analysts
5
Last Close Price
90.10TWD
Average target price
120.00TWD
Spread / Average Target
+33.19%

Quarterly revenue - Rate of surprise