Qnity Electronics, Inc. has further expanded its offerings for advanced packaging with the introduction of the Stackplane family of slurries for chemical mechanical planarization (CMP). Qnity's Stackplane CMP slurries are designed for the unique CMP complexities of advanced packaging applications. Stackplane slurries support the industry's move toward shrink and stack, where continued transistor scaling is paired with the stacking and integration of multiple chips to deliver the bandwidth and density that AI and high-performance computing need.
Many advanced packaging programs require numerous distinct CMP steps, including planarization following hybrid bonding and through-silicon via (TSV) integration. The Stackplane product family brings together a comprehensive slurry portfolio to address the varied requirements of these critical CMP processes. The Stackplane platform combines commercialized products with next-generation slurry technologies under a unified portfolio focused on advanced packaging.
The platform includes slurry technologies engineered for consistent planarization at both the wafer and die level, along with the selectivity needed for advanced packaging processes. Key solutions include: Stackplane SP1000 and SP2000 series for hybrid bonding, Stackplane SP3000 series for TSV applications, Stackplane SP4000 series for polymer CMP, Stackplane SP5000 series for emerging technologies, such as panel-level through-glass vias (TGVs) and glass CMP. Qnity will feature Stackplane slurries at SEMICON Taiwan, Sept.
2-4, in Taipei, Taiwan. Visitors can learn more at booth S7930 in the Materials Pavilion at TaiNEX 2 and attend a presentation by Allison Hsu, Taiwan Slurry R&D Manager at Qnity, on the TechXPOT Stage Sept. 2. The company will also highlight the platform at the International Conference on Planarization/CMP Technology (ICPT), Oct.
19-22, in Seoul, South Korea. Qnity experts can recommend complementary CMP pads and post-CMP cleans as part of the company's end-to-end advanced packaging portfolio.
