Robert Dennehy
Net worth: 5 M $ as of 2026-06-29
Net worth: 5 M $ as of 2026-06-29
Currently, Robert Dennehy is Senior Vice President-Operations for MACOM Technology Solutions Holdings, Inc. and Senior Vice President at MACOM Technology Solutions, Inc. (a subsidiary of MACOM Technology Solutions Holdings, Inc.). Mr. Dennehy received an undergraduate degree from Henley Business School Ltd.
| Company | Date | Number of shares | Valuation | Valuation date |
|---|---|---|---|---|
| 2026-05-14 | 13,010 ( 0.02% ) | 5 M $ | 2026-06-29 |
| Companies | Position | Start |
|---|---|---|
| MACOM TECHNOLOGY SOLUTIONS HOLDINGS, INC. | Chief Operating Officer | 2011-02-28 |
| IQE PLC | Director/Board Member | 2026-06-30 |
MACOM Technology Solutions, Inc.
MACOM Technology Solutions, Inc. SemiconductorsElectronic Technology Supplies semiconductors and subassemblies for microwave and milliwave applications | Director/Board Member | 2026-05-27 |
| Companies | Position | End |
|---|---|---|
MACOM Technology Solutions Ltd.
MACOM Technology Solutions Ltd. MACOM Technology Solutions Ltd. designs and manufactures high-performance semiconductor products for RF, microwave, mmWave, analog, mixed signal, and optical technologies. The company is based in Kilcoolishal, Ireland. The Irish company serves industries such as telecommunications, industrial, defense, aerospace, broadcast video, CATV, data centers, satellite communications, and wireless networking. Its portfolio includes components like variable gain amplifiers, digital phase shifters, hybrid amplifiers, solid state power amplifier modules, switches, attenuators, diodes, capacitors, mixers, and integrated circuits. MACOM specializes in advanced technologies including GaN-on-SiC and LDMOS power transistors for high-power telecommunication systems, multifunction GaAs and silicon radar core chips, and high-speed photodiodes and photoreceivers for optical communications supporting 5G, data center, and aerospace applications. The company also provides foundry and design services, integrated assemblies, and modules that address size, weight, power, and thermal management challenges for next-generation communication networks and systems. | Chief Executive Officer | 2011-02-28 |
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| Private companies | 5 |
|---|---|
Henley Business School Ltd.
Henley Business School Ltd. Other Consumer ServicesConsumer Services Functions as a College/University | Consumer Services |
IQE Plc
IQE Plc Industrial MachineryProducer Manufacturing Manufactures semiconductor wafers | Producer Manufacturing |
MACOM Technology Solutions, Inc.
MACOM Technology Solutions, Inc. SemiconductorsElectronic Technology Supplies semiconductors and subassemblies for microwave and milliwave applications | Electronic Technology |
MACOM Technology Solutions Holdings, Inc.
MACOM Technology Solutions Holdings, Inc. SemiconductorsElectronic Technology Operates as a holding company whose subsidiaries provides high-performance analog semiconductor solutions | Electronic Technology |
MACOM Technology Solutions Ltd.
MACOM Technology Solutions Ltd. MACOM Technology Solutions Ltd. designs and manufactures high-performance semiconductor products for RF, microwave, mmWave, analog, mixed signal, and optical technologies. The company is based in Kilcoolishal, Ireland. The Irish company serves industries such as telecommunications, industrial, defense, aerospace, broadcast video, CATV, data centers, satellite communications, and wireless networking. Its portfolio includes components like variable gain amplifiers, digital phase shifters, hybrid amplifiers, solid state power amplifier modules, switches, attenuators, diodes, capacitors, mixers, and integrated circuits. MACOM specializes in advanced technologies including GaN-on-SiC and LDMOS power transistors for high-power telecommunication systems, multifunction GaAs and silicon radar core chips, and high-speed photodiodes and photoreceivers for optical communications supporting 5G, data center, and aerospace applications. The company also provides foundry and design services, integrated assemblies, and modules that address size, weight, power, and thermal management challenges for next-generation communication networks and systems. |
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