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Union Semiconductor Co., Ltd. Reports Earnings Results for the Half Year Ended June 30, 2024 CI
Union Semiconductor Gets Nod to Issue Convertible Bonds; Shares Down 3% MT
Tranche Update on Union Semiconductor Co., Ltd.'s Equity Buyback Plan announced on December 23, 2023. CI
Union Semiconductor Co., Ltd. Reports Earnings Results for the First Quarter Ended March 31, 2024 CI
Tranche Update on Union Semiconductor Co., Ltd.'s Equity Buyback Plan announced on December 23, 2023. CI
Union Semiconductor Co., Ltd. Reports Earnings Results for the Full Year Ended December 31, 2023 CI
Tranche Update on Union Semiconductor Co., Ltd.'s Equity Buyback Plan announced on December 23, 2023. CI
Union Semiconductor Co., Ltd. announces an Equity Buyback for CNY 100 million worth of its shares. CI
Union Semiconductor Co., Ltd. authorizes a Buyback Plan. CI
Union Semiconductor to Issue 1.15 billion Yuan Convertible Bonds MT
Union Semiconductor Co., Ltd. Reports Earnings Results for the Nine Months Ended September 30, 2023 CI
Union Semiconductor Co., Ltd.(SHSE:688403) added to Shanghai Stock Exchange Composite Index CI
Union Semiconductor Co., Ltd.(SHSE:688403) added to Shanghai Stock Exchange A Share Index CI
Union Semiconductor Co., Ltd. Reports Earnings Results for the Half Year Ended June 30, 2023 CI
Certain A Shares of Union Semiconductor Co., Ltd. are subject to a Lock-Up Agreement Ending on 10-AUG-2023. CI
Union Semiconductor Co., Ltd. Reports Earnings Results for the First Quarter Ended March 31, 2023 CI
Union Semiconductor Co., Ltd. Reports Earnings Results for the Full Year Ended December 31, 2022 CI
Union SemiConductor Co., Ltd. announced that it expects to receive CNY 300 million in funding from Union Semiconductor Co., Ltd. CI
Union Semiconductor Co., Ltd. has completed an IPO in the amount of CNY 1.482699 billion. CI
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Logo Union Semiconductor (Hefei) Co., Ltd.
Union Semiconductor Hefei Co Ltd is a China-based company that mainly provides comprehensive services for full-process packaging and testing of display driver chips. The Company's main businesses include front-end gold bumping, wafer testing (CP) and back-end chip-on-glass (COG) and chip-on-film (COF). Its packaging and testing services are mainly used in display driver chips for various mainstream panels. The Company mainly distributes its products in domestic market, including Hong Kong and Taiwan.
Employees
1,439
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