E&R ENGINEERING CORPORATION is principally engaged in the manufacture and sale of packaging and testing equipment for semiconductors and electronics. The Companyâ€™s products consist of laser markers, plasma cleaning machines, dispensers, molding cutting equipment, embossed carrier tapes, flexible printed circuit (FPC) equipment and related components, as well as automation equipment, among others. The Companyâ€™s products are mainly applied in semiconductor industry. The Company distributes its products within domestic market and to overseas markets.

Employees

Sector

Semiconductor Equipment & Testing

More about the company

Quotes

Date	Price	Change	Volume
26-11-03	NT$150.00	+0.67%	1,500,412
26-11-03	NT$149.00	-8.31%	1,703,045
26-11-02	NT$162.50	-0.61%	945,025
26-10-30	NT$163.50	-6.30%	1,514,119
26-10-29	NT$174.50	-4.12%	819,027

End-of-day quote Taipei Exchange

More quotes

Quarterly revenue - Rate of surprise

Rate of surprise - Net sales - Quarterly - E&R Engineering Corporation

Company calendar

End-of-day quote Taipei Exchange 2026-11-04			5-day change	1st Jan Change
150.00 ^TWD	+0.67%		-12.54%	+36.99%

10-06	E&R Engineering Corp. Spotlights High-Precision Cpo and Advanced Packaging Solutions At Semi West 2026	CI
10-05	E&R Engineering to Launch New Malaysia Plant: Expanding Global Packaging Materials Production and Localized Services	CI

Market Cap	16.1B 491M 438M 403M 366M 687M 46.47B 704M 4.81B 1.93B 24.53B 1.84B 1.8B 77.75B	P/E 2024	-170x	P/E 2025	-118x
Enterprise Value	16.38B 499M 446M 410M 372M 699M 47.28B 716M 4.89B 1.97B 24.95B 1.87B 1.83B 79.09B	EV / Sales 2024	5.31x	EV / Sales 2025	6.49x
Free-Float	76.64%	Yield 2024 *	-	Yield 2025	-

10-06	E&R Engineering Corp. Spotlights High-Precision Cpo and Advanced Packaging Solutions At Semi West 2026	CI
10-05	E&R Engineering to Launch New Malaysia Plant: Expanding Global Packaging Materials Production and Localized Services	CI
10-05	E&R Engineering to Open Malaysian Unit	MT
08-26	E&R Engineering Launches New High-Precision Laser Drilling and Advanced Hybrid Plasma Solutions for CPO and Advanced Packaging at SEMICON Taiwan 2026	CI
08-11	E&R Engineering Corporation Reports Earnings Results for the Second Quarter and Six Months Ended June 30, 2026	CI
05-13	E&R Engineering Corporation Reports Earnings Results for the First Quarter Ended March 31, 2026	CI
04-30	E&R Engineering Showcases Advanced Laser and Plasma Solutions At SEMICON SEA 2026	CI
03-18	E&R Engineering Corp. Opens Portland Office and Expands Dual-U.S. Presence	CI
03-13	E&R Engineering Corporation Reports Earnings Results for the Full Year Ended December 31, 2025	CI
02-10	Capital Securities Downgrades E&R Engineering Corporation to Neutral from Buy, Price Target is NT$98	MT
11-11	E&R Engineering Corporation Reports Earnings Results for the Third Quarter and Nine Months Ended September 30, 2025	CI
25-09-24	E&R Engineering Corp. Strengthens North American Semiconductor Presence with New U.S. Subsidiary	CI
25-08-10	E&R Engineering Corporation Reports Earnings Results for the Second Quarter and Six Months Ended June 30, 2025	CI

1 day	+0.67%
1 week	-12.54%
Current month	-8.26%
1 month	-29.74%
3 months	-9.64%
6 months	-22.48%
Current year	+36.99%

E&R Engineering Corporation Stock

Stocks

8027

TW0008027004

Semiconductor Equipment & Testing

Valuation: E&R Engineering Corporation

Chart: E&R Engineering Corporation

Latest news: E&R Engineering Corporation

Analysts' recommendations: E&R Engineering Corporation

Quotes and Performance

Price Extremes

Managers and Directors: E&R Engineering Corporation

Semiconductor Machinery Manufacturing

Financials

Company Profile

Quotes

Quarterly revenue - Rate of surprise

1 week	140	183.5
1 month	140	218
Current year	85.8	297
1 year	83.2	297
3 years	54.8	297
5 years	41.85	297
10 years	12.99	297

Manager	Title	Age	Since
Kun Shan Chen CEO	Chief Executive Officer	-	2026-06-17
Kuang Ming Chang CEO	Chief Executive Officer	-	-
Chiang Ting Huang CIO	Chief Investment Officer	-	2026-06-17

Director	Title	Age	Since
Ming Ching Wang CHM	Chairman	-	1994-10-23
Kuang Ming Chang BRD	Director/Board Member	-	1998-07-31
Kun Shan Chen BRD	Director/Board Member	-	2023-06-20

Add to a list 0 selected To use this feature you must be a member Log in Sign up	Change	5-day change	1-year change	3-year change	Capi.($)
E&R ENGINEERING CORPORATION	+0.67%	-12.54%	+61.81%	+131.84%	487M
ASML HOLDING N.V.	-3.42%	-10.20%	+45.71%	+126.06%	593B
APPLIED MATERIALS, INC.	-3.29%	-11.76%	+59.47%	+161.53%	303B
LAM RESEARCH CORPORATION	-2.41%	-11.85%	+43.63%	+250.13%	288B
KLA CORPORATION	-2.66%	-5.33%	+25.94%	+201.31%	204B
ADVANTEST CORPORATION	-3.35%	+2.10%	+49.43%	+775.41%	163B
TOKYO ELECTRON LIMITED	-3.42%	+2.91%	+41.35%	+129.42%	143B
ASE TECHNOLOGY HOLDING CO., LTD.	+1.79%	-3.69%	+154.88%	+433.62%	82.55B
NAURA TECHNOLOGY GROUP CO., LTD.	+10.00%	+9.62%	+33.54%	+181.25%	53.09B
TERADYNE, INC.	-5.35%	-19.55%	+43.46%	+187.63%	42.05B
Average	-1.13%	-1.72%	+55.92%	+257.82%	187.17B
Weighted average by Cap.	-2.57%	-1.20%	+49.88%	+232.40%

	2024	2025
Net sales	1.64B 50.13M 44.78M 41.14M 37.36M 70.16M 4.75B 71.92M 491M 198M 2.51B 188M 184M 7.94B	1.81B 55.14M 49.26M 45.25M 41.09M 77.17M 5.22B 79.11M 540M 217M 2.76B 207M 203M 8.74B
Net income	-51.12M -1.56M -1.39M -1.28M -1.16M -2.18M -148M -2.24M -15.26M -6.14M -77.89M -5.85M -5.72M -247M	-97.8M -2.98M -2.66M -2.45M -2.22M -4.17M -282M -4.28M -29.19M -11.74M -149M -11.19M -10.95M -472M
Net Debt	-248M -7.57M -6.76M -6.21M -5.64M -10.6M -717M -10.86M -74.16M -29.83M -379M -28.42M -27.81M -1.2B	279M 8.49M 7.58M 6.97M 6.33M 11.88M 804M 12.18M 83.16M 33.45M 424M 31.86M 31.18M 1.35B